Vitrified Diamond Wheel for Silicon, SiC & Sapphire Wafer Back-Grinding

Name
Vitrified Diamond Wheel for Silicon, SiC & Sapphire Wafer Back-Grinding
Abrasive
Diamond
Bond Type
Vitrified
Workpiece Material
Silicon; SiC; GaAs semiconductor; Sapphire
Application
Back-grinding and surface thinning of silicon, SiC, and GaAs semiconductor wafers; High-precision flattening and polishing of sapphire substrates and optical windows.
Customization
               ✓ Custom Specification Available            


Description

Product Overview
Designed for high-precision wafer thinning and polishing in semiconductor manufacturing. Its porous vitrified bond matrix reduces cutting resistance and friction heat, minimizing micro-cracks, subsurface damage, and wafer warping.
Key Applications
✓
Semiconductor Wafer Thinning
Back-grinding and surface thinning of silicon, SiC, and GaAs semiconductor wafers.
✓
Sapphire & Optical Windows
High-precision flattening and polishing of sapphire substrates and optical windows.
Why Choose Us (Advantages):
Minimal Subsurface Damage
Ultra-fine grain distribution prevents deep micro-cracks.
Low TTV (Total Thickness Variation)
Ensures uniform wafer thickness and high planarity.
Self-Sharpening Matrix
Maintains low, steady spindle power during high-speed thinning.
Stable Quality and Bulk Supply
Standard models available in stock; Approx. 7 Working Days to Dispatch.
Common Specifications
COMMON Specs
Shapes
6A2T, 2A2T (Ring/Segmented type)
Standard Diameters
200mm, 300mm, 350mm (8", 12" back-grinders)
Concentration
50%, 75%, 100%
Grit Range
Mesh #325 to Micron #3000 (D3 to D46)
Application Positioning
Suitable for back-grinding of monocrystalline silicon, SiC, sapphire, and GaN wafers on wafer thinners such as DISCO and Strasbaugh.
All sizes are customizable. Please share your drawings or specific dimensions with us for a precise quotation.
Machining Cases

Vitrified Diamond Wheel for Silicon

Vitrified Diamond Wheel for Silicon

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