Metal Bond Diamond Cut-Off Wheel for Quartz, Ceramics & Hard Material Dicing

Name

Metal Bond Diamond Cut-Off Wheel for Quartz, Ceramics & Hard Material Dicing

Abrasive

Diamond

Bond Type

Metal

Workpiece Material

Optical Quartz; Technical Ceramics; Semiconductor; Tungsten Carbide

Application

Precision dicing and cut-off of optical quartz, technical ceramics, and semiconductor rods; Slotting and sizing of tungsten carbide wear parts and refractory materials.

Customization

✓ Custom Specification Available

Send email to us Print as PDF

Description

Product Overview

Engineered for deep slitting, slotting, and cut-off operations on ultra-hard non-metallic materials and hard alloys. Featuring continuous rim or segmented matrix options with steel cores to prevent blade deflection during deep feed cuts.

Key Applications

✓

Quartz & Ceramic Dicing

Precision dicing and cut-off of optical quartz, technical ceramics, and semiconductor rods.

✓

Carbide Slotting & Sizing

Slotting and sizing of tungsten carbide wear parts and refractory materials.

Why Choose Us (Advantages):

Deflection-Free Cutting

Reinforced steel core ensures straight cuts without blade drift.

Aggressive Cleavage

Sintered diamond matrix bites fast into dense materials.

Clean Sidewalls

Minimizes edge chipping and material kerf loss.

Stable Quality and Bulk Supply

Standard models available in stock; Approx. 7 Working Days to Dispatch.

Common Specifications

COMMON Specs

Shapes

1A1R (Cut-off Blade), Segmented Saw Blades

Standard Diameters

100mm, 150mm, 200mm, 300mm, 350mm
(Thickness: 0.8mm – 3.0mm)

Concentration

75%, 100%

Grit Range

D126 – D252

Application Positioning

Suitable for precision cutting and slotting of optical quartz, technical ceramics, stone, and tungsten carbide rods on dicing saws, stone cutting machines, and CNC machining centers.

All sizes are customizable. Please share your drawings or specific dimensions with us for a precise quotation.

Machining Cases

Metal Bond Diamond Cut-Off Wheel for Quartz